STI Electronics, Inc.

Service Experience:

Since 1982, STI Electronics, Inc. (STI) has been the premier full service organization for training, consulting, laboratory analysis, prototyping, and small to medium volume PCB assembly in the electronics industry. STI also produces a complete line of solder training kits and training support products. In addition, STI develops and distributes other products for the soldering and electronics assembly industries.

Jim D. Raby, founder and Technical Director of STI, has over forty-five years of experience in the industry including development of the NASA and Department of Defense Soldering Schools. He initiated the Zero Defect Program for Wave Soldering in addition to developing and implementing WS-6536D and the DoD-Std-2000 Specification programs. Jim's experience, expertise, and industry leadership are the foundation on which all STI products and services are developed and produced.

The goal of STI is to meet or exceed any standards of workmanship demanded by our customers. No one in the industry is better prepared to meet the expanding standards of quality required in today's competitive market than Soldering Technology International, Inc.

Past Performance:

ONR Standard Missile Office

STI Electronics Inc. was tasked to redesign a current SM-2 encoder/decoder CCA utilizing the IC/DT Technology to increase overall robustness and miniaturization of the CCA. This task also reviewed manufacturing and processing techniques as well as material assessments to insure CCA capability.

STI Electronics utilized all three of its major departments in this redesign utilizing the IC/DT technology. This project is a production and analytical support contract to build prototypes and assess the feasibility and capability of the IC/DT technology and its insertion into a standard missile program. Its objectives are to miniaturize and increase robustness while increasing capability of the CCA. STI was able to accomplish these objectives successfully by build prototypes that are drop in replacements for the current encoder/decoder CCA into the existing guidance suite while miniaturizing and meeting the robustness requirements for future applications. This technology has passed all the bench and system level testing of the current CCA while demonstrating the feasibility of utilization in future standard missile programs where miniaturization and increased system capabilities and robustness are required.

STI also performed this task on a firm fixed price contract. The contract was on schedule and budget.

Northrop Grumman Corporation - Electro-Optical Systems

STI ELECTRONICS provides high volume production support for SMT power supplies and analytical lab support for failure analysis of the complete system from all subsystems down to the component level.

STI ELECTRONICS provides full production and analytical support for the production of various night vision goggle systems. STI produces the high voltage power supplies in the manufacturing lab and then has a support contract for analytical lab support of all subsystems for the complete system. STI also performs and builds next generation power supplies for future systems and also provides analytical support for the qualification of the subsystems. This arrangement has been very successful for the launch of new products as well as the support of legacy systems.

ONR Standard Missile 2 Block IIIB Program

STI provided senior design engineering, manufacturing expertise, and analysis services in support of producing 4 link processor circuit card assembly’s utilizing the STI imbedded component die technology (IC/DT) for the Standard Missile 2 Block IIIB program.

STI manufactures both commercial and military circuit card assemblies for various applications. STI also has a full service analytical lab and failure analysis lab utilized by both commercial and military/DoD contractors. STI also has a full service microelectronics lab housed inside a class 1000 cleanroom.

STI utilizes a full root cause and failure analysis approach to solving problems by truly understanding all the failure mechanisms. Thus the reason for housing a department solely setup to perform these types of analysis. STI is a leader in performing failure analysis work for outside customers thus increasing our expertise base on failure analysis techniques.

The summary of deliverables for the contract is 4 link processor cards utilizing the IC/DT patented technology to show capability in miniaturizing and reducing thermal problems on existing designed link processor cards.

STI had a successful demonstration test flight and target acquisition on a live test firing at point MUGU.